T5500 Ram Slots

Pengalaman menarik saat menginstall DELL Workstation T5500 untuk video editing. Secara default memory 4GB sudah terpasang dari vendornya. Computer berfungsi dengan baik. Namun karena dirasa kurang besar maka memory di upgrade ke 8GB, cukup besar untuk editing gambar dan video.

8GB RAM Memory for Dell Precision Workstation T5500 (DDR3-12800 - Reg) - Workstation Memory Upgrade OFFTEK Part Number:-FT8GKR72V4K-1414271 Capacity:-8GB Module Form Factor:-240 Pin Dimm Memory Type:-DDR3 Bandwidth:-DDR3-12800 (PC3-1600) Memory Specs:-240 Pin 1.5v DDR3 PC3-12800 ECC Registered Dimm (Dual Rank) Premier Brand Memory. There are six memory slots on the system board. The slots are numbered DIMM1 through DIMM6. DIMM1 is furthest from the processor. In addition, the dual -processor riser features three additional memory slots. DDR3 SDRAM, or double-data-rate three synchronous dynamic random access memory, is a random access memory technology. Page 3: Memory Subsystem 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB 8 GB NOTE: If more than one Quad rank DIMM is installed within a channel (DIMM1 & DIMM4, DIMM2 & DIMM5, DIMM3 & DIMM6) then the maximum DDR3 speed is reduced to.

Stok yang ada di gudang adalah memory biasa , yang biasa dipakai untuk PC desktop. Namun ternyata pada saat dipasang dan computer dijalankan ada pesan error bahwa penempatan memory tidak sesuai. Terdapat dua bay memory yaitu yang di dalam main board dan di extended bay memory. Saat itu dipasang semua memory dengan kapasitas 2GB. Selanjutnya setelah penempatan memory dipasang dengan benar error lain timbul yaitu NON-ECC memory tidak bisa dipasang di computer ini. Lewat web DELL ditemukan jawaban dari semua permasalahan di computer workstation.

Berikut adalah petikan dari DELL untuk konfigurasi dan jenis memory untuk DELL Workstation T5500.

Your computer uses 1066 MHz and 1333Mhz DDR3 unbuffered or registered ECC SDRAM memory. DDR3 SDRAM, or double-data-rate three synchronous dynamic random access memory, is a random access memory technology. It is a part of the SDRAM family of technologies, which is one of many DRAM (dynamic random access memory) implementations, and is an evolutionary improvement over its predecessor, DDR2 SDRAM.

The primary benefit of DDR3 SDRAM is its ability to run its I/O bus at four times the speed of the memory cells it contains, thus enabling faster bus speeds and higher peak throughputs than earlier technologies. This is achieved at the cost of higher latency. Also, the DDR3 standard allows for chip capacities of 512 megabit to 8 gigabit, effectively enabling memory modules of maximum 16 gigabyte in size.

DDR3 memory comes with a promise of a power consumption reduction of 30% compared to current commercial DDR2 modules due to DDR3’s 1.5 V supply voltage. This supply voltage works well with the 90 nm fabrication technology used for most DDR3 chips. Some manufacturers further propose to use “dual-gate” transistors to reduce leakage of current.

The main benefit of DDR3 comes from the higher bandwidth made possible by DDR3’s 8 bit deep prefetch buffer, whereas DDR2’s is 4 bits, and DDR’s is 2 bits deep.

Memory Modules

Supported Memory Configurations

Memory Subsystem

The memory subsystem consists of three DDR3 memory channels attached to each processor. All single-processor configurations have six DIMM slots (two per channel) attached to the primary processor located on the system board. Dual-processor configurations require an optional riser card that contains the secondary processor and the DIMMs associated with the secondary processor. There are six DIMM slots on the riser, for a total of twelve DIMMs in the system.

Memory Slots

There are six memory slots on the system board. The slots are numbered DIMM1 through DIMM6. DIMM1 is furthest from the processor.

In addition, the dual-processor riser features three additional memory slots. The slots are numbered DIMM1 through DIMM3. DIMM1 is furthest from the processor.

Memory Population Rules

Your computer requires DIMMs within a channel to be populated starting with the DIMMs farthest from the processor first. This means the DIMM slots 1, 2 and 3 must be populated before DIMM slots 4, 5 and 6. In addition, when populating a Quad-rank DIMM with a Single- or Dual-rank DIMM in the same channel, the Quad-rank DIMM must be populated farthest from the CPU.

To maximize available memory bandwidth, DIMMs within a configuration should generally be spread across as many channels as possible before populating multiple DIMMs per channel. The population guidelines below help to achieve this.

Single CPU configurations (6 DIMM slots on MB)

• If configuration contains DIMMs of all the same size, populate in the following order: DIMM1, DIMM2, DIMM3, DIMM4, DIMM5, DIMM6
• If configuration contains DIMMs of mixed sizes, populate the larger DIMMs first. For example, for a 4GB configuration consisting of one 2GB DIMM and two 1GB DIMMs, the population would be DIMM1=2GB, DIMM2=1GB, DIMM3=1GB, DIMM4=empty, DIMM5=empty, DIMM6=empty.

Dual CPU configurations (6 DIMM slots on MB plus 3 DIMM slots on Riser)

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• If configuration contains DIMMs of all the same size, populate in the following order: MB_DIMM1, Riser_DIMM1, MB_DIMM2, Riser_DIMM2, MB_DIMM3, Riser_DIMM3, MB_DIMM4, MB_DIMM5, MB_DIMM6.
• If configuration contains DIMMs of mixed sizes, populate the larger DIMMs in the Riser.

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